INOLOPE EXPO will be held at Dortmund Exhibition Centre between 12 and 14 February 2025. The new show will focus on absolutely all the latest developments in 'smart shell' building envelopes which have a key role to play in architecture and facility management.

Dortmund, 03 June 2024 – The very first INOLOPE EXPO – the buyer-meets-seller forum for innovative building envelopes – between 12 and 14 February 2025 will see exhibitors showcasing their extensive expertise in optimising building performance and resource-saving construction methods. The enthusiasm for the show's concept can be seen by the fact that well-known businesses have already secured their places almost nine months before the show is due to commence. 

Big names in the industry coming together

Among other things, INOLOPE EXPO will focus on the innovative trend of exterior insulation and finishing systems (EIFS) also known as external wall insulation systems (EWIS). This technology revolutionises the design of building envelopes by combining customisation with optimised thermal insulation. Sto SE & Co. KGaA, the global market leader in EIFS, recipient of an award from Germany's WirtschaftsWoche business magazine, announced its participation in May of this year and will be bringing its extensive expertise to INOLOPE EXPO. As a meeting point for the major players in the industry, Messe Dortmund is also pleased to welcome other key market leaders such as Carl Stahl GmbH with its extensive product portfolio on ergonomics and safety, and FLO Systems GmbH, a specialist in flat roofing matters. Reisser Schraubentechnik GmbH and the manufacturer of Okalux have also booked spaces at the show. Reisser Schraubentechnik GmbH has extensive expertise in the installation of fastening elements on building façades, while the manufacturer of Okalux is an expert in the intelligent use of daylight, for example with light-diffusing insulating glass. With this line-up of market players, INOLOPE EXPO is positioning itself as the meeting place for experts in the industry.